Design & Manufacturing Forum - May 21
Date and Time
Thursday May 21, 2015
11:00 AM - 2:00 PM CDT
Thursday, May 21
11:00 am Doors open - Check in opens
11:30 am Lunch buffet with entrees, salad & dessert, beverage
11:45 am Announcements
12:00 pm Presentation begins
1:00 pm Adjourn formal meeting
1:10 pm Round table technical conversation/Workshop - all are welcome
2:00 pm Adjourn
Location
Doubletree Hotel
4099 Valley View Lane
Dallas, TX 75244
Near the intersection of I-635 @ Midway RD, 1 block NW).
Lower level, watch for the SMTA signs to Palm Court.
MAP
Fees/Admission
MTBC members - $15 (cash at door or credit card on website)
Non-Members: $20 (cash at door or credit card on website)
You must make a reservation to gtanel@qcg.com
no later than May 19 if you plan to pay at the door.
Contact Information
Gary Tanel - QCG Tri--Chair, MTBC Design & Mfg Forum
Send Email
Description
MTBC Design & Mfg Forum with co-host SMTA (Surface Mount Technology Association)
Presentation, Luncheon, & Workshop
Program:
"Blurring the lines between Packaging & Assembly: Embedding Components for Performance and Miniaturization"
with Guest Speaker: Charles E Bauer, Ph.D., TechLead Corporation
Embedding active and passive components in the circuit board offers improved performance by cutting interconnect parasitics, reliability gains by eliminating wire-bonds and solder-bumps, and reduced cost and size by parts list reduction. Like every new development, these benefits come at a price: disrupted logistics, yield management concerns, and limited rework and repair options. This presentation reviews the application and implementation of commercial and developmental technologies to embed active as well as passive components in printed circuit boards and other interconnect substrates. Topics include advanced material options, die contact metallurgy and processes, embedded chip packaging, and options for embedded passives. Solutions include organic-based (PWB, flex, and thin film) systems and ceramic-based (thick film, LTCC, and HTCC). Examples of specific embedded component structures, including Verdant’s Occam, Freescale’s RCP, and Imbera’s IMB technologies, demonstrate both the power and limitations of these approaches.
Speaker Bio:
A graduate of Stanford University, Charles E. Bauer, Ph.D. focuses in the areas of strategic technology planning, market analysis and international business development.
With more than 30 years’ experience, Dr. Bauer also serves on Advisory Boards for a variety of academic and governmental institutions bringing tremendous breadth and depth to his work.
Currently, Chuck serves as Senior Managing Director at TechLead Corporation and honors include:
- Founder, Pan Pacific Microelectronics Symposium
- Fellow, IMAPS (1994), IMAPS President (2001-2002)
- SMTA Board of Directors (1997- 2001)
- SMTA International Leadership Award (2007);
- SMTA Luminary (2009)
- Senior Member IEEE/CPMT
- Founder, ISHM/IMAPS Advanced Technology Workshop Program
