BEGIN:VCALENDAR VERSION:2.0 PRODID:-//ChamberMaster//Event Calendar 2.0//EN METHOD:PUBLISH X-PUBLISHED-TTL:P3D REFRESH-INTERVAL:P3D CALSCALE:GREGORIAN BEGIN:VEVENT DTSTART:20150521T160000Z DTEND:20150521T190000Z X-MICROSOFT-CDO-ALLDAYEVENT:FALSE SUMMARY:Design & Manufacturing Forum - May 21 DESCRIPTION:MTBC Design & Mfg Forum with co-host SMTA (Surface Mount Technology Association)\n\nPresentation\, Luncheon\, & Workshop\n\n\n\nProgram:\n\n"Blurring the lines between Packaging & Assembly: Embedding Components for Performance and Miniaturization"\n\nwith Guest Speaker: Charles E Bauer\, Ph.D.\, TechLead Corporation\n\n\n\nEmbedding active and passive components in the circuit board offers improved performance by cutting interconnect parasitics\, reliability gains by eliminating wire-bonds and solder-bumps\, and reduced cost and size by parts list reduction. Like every new development\, these benefits come at a price: disrupted logistics\, yield management concerns\, and limited rework and repair options. This presentation reviews the application and implementation of commercial and developmental technologies to embed active as well as passive components in printed circuit boards and other interconnect substrates. Topics include advanced material options\, die contact metallurgy and processes\, embedded chip packaging\, and options for embedded passives. Solutions include organic-based (PWB\, flex\, and thin film) systems and ceramic-based (thick film\, LTCC\, and HTCC). Examples of specific embedded component structures\, including Verdant's Occam\, Freescale's RCP\, and Imbera's IMB technologies\, demonstrate both the power and limitations of these approaches.\n\n\n\nSpeaker Bio:\n\nA graduate of Stanford University\, Charles E. Bauer\, Ph.D. focuses in the areas of strategic technology planning\, market analysis and international business development.\n\nWith more than 30 years' experience\, Dr. Bauer also serves on Advisory Boards for a variety of academic and governmental institutions bringing tremendous breadth and depth to his work.\n\nCurrently\, Chuck serves as Senior Managing Director at TechLead Corporation and honors include:\n\n\n Founder\, Pan Pacific Microelectronics Symposium\n Fellow\, IMAPS (1994)\, IMAPS President (2001-2002)\n SMTA Board of Directors (1997- 2001)\n SMTA International Leadership Award (2007)\; \n SMTA Luminary (2009)\n Senior Member IEEE/CPMT\n Founder\, ISHM/IMAPS Advanced Technology Workshop Program\n\n\nTechLead Corporation\, an international management and engineering consulting firm with offices in Asia\, Europe\, and North America\, stimulates the growth and success of its clients. Differentiating from other consultancies\, TechLead emphasizes rigorous analysis and expert judgment resulting in actionable recommendations. TechLead's staff of seasoned professionals combines unique and extensive knowledge with more than 140 years of in-depth industry experience to transform data into INFORMATION and knowledge into UNDERSTANDING yielding substantiated insight into your organization's most demanding business and technology needs. X-ALT-DESC;FMTTYPE=text/html:

MTBC Design &\; Mfg Forum with co-host \;SMTA (Surface Mount Technology Association)

\n\n

Presentation\, Luncheon\, &\; Workshop
\n
\nProgram:

\n\n

"\;Blurring the lines between Packaging &\; Assembly: Embedding Components for Performance and Miniaturization"\;
\nwith Guest Speaker: Charles E Bauer\, Ph.D.\, TechLead Corporation
\n
\nEmbedding active and passive components in the circuit board offers improved performance by cutting interconnect parasitics\, reliability gains by eliminating wire-bonds and solder-bumps\, and reduced cost and size by parts list reduction. Like every new development\, these benefits come at a price: disrupted logistics\, yield management concerns\, and limited rework and repair options. This presentation reviews the application and implementation of commercial and developmental technologies to embed active as well as passive components in printed circuit boards and other interconnect substrates. Topics include advanced material options\, die contact metallurgy and processes\, embedded chip packaging\, and options for embedded passives. Solutions include organic-based (PWB\, flex\, and thin film) systems and ceramic-based (thick film\, LTCC\, and HTCC). Examples of specific embedded component structures\, including Verdant&rsquo\;s Occam\, Freescale&rsquo\;s RCP\, and Imbera&rsquo\;s IMB technologies\, demonstrate both the power and limitations of these approaches.
\n
\nSpeaker Bio:
\nA graduate of Stanford University\, Charles E. Bauer\, Ph.D. focuses in the areas of strategic technology planning\, market analysis and international business development.
\nWith more than 30 years&rsquo\; experience\, Dr. Bauer also serves on Advisory Boards for a variety of academic and governmental institutions bringing tremendous breadth and depth to his work.
\nCurrently\, Chuck serves as Senior Managing Director at TechLead Corporation and honors include:

\n\n\n\n
TechLead Corporation\, an international management and engineering consulting firm with offices in Asia\, Europe\, and North America\, stimulates the growth and success of its clients. Differentiating from other consultancies\, TechLead emphasizes rigorous analysis and expert judgment resulting in actionable recommendations. TechLead'\;s staff of seasoned professionals combines unique and extensive knowledge with more than 140 years of in-depth industry experience to transform data into INFORMATION and knowledge into UNDERSTANDING yielding substantiated insight into your organization&rsquo\;s most demanding business and technology needs.
\n LOCATION:Doubletree Hotel 4099 Valley View Lane Dallas\, TX 75244 Near the intersection of I-635 @ Midway RD\, 1 block NW). Lower level\, watch for the SMTA signs to Palm Court. MAP UID:e.9090.3124 SEQUENCE:3 DTSTAMP:20260423T083946Z URL:https://business.techtitans.org/events/details/design-manufacturing-forum-may-21-05-21-2015-3124 END:VEVENT END:VCALENDAR