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BEGIN:VEVENT
DTSTART:20200717T170000Z
DTEND:20200717T180000Z
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SUMMARY:Tech Industry Luncheon - July 17
DESCRIPTION:How AI\, IoT and 5G are changing the semiconductor industry\nFeaturing James Klein\, President of Infrastructure and Defense Products\, Qorvo\n\n\n\npresented by \n\n\n\nAI\, the Internet of Things and 5G are rapidly changing the semiconductor industry in its quest to meet the world's insatiable need for more electronics especially in the automotive and manufacturing sectors.  This presentation will explore the opportunities and the challenges facing the semiconductor industry as it develops the next generation of chips that will transform the industry and ultimately change our world.\n\n\n\nAbout the speaker:\n\n\n\nJames L. Klein is the President of Infrastructure and Defense Products at Qorvo in Richardson\, Texas. The Infrastructure and Defense Products division comprises a broad portfolio of industry leading products and foundry services supporting applications including radar\, next generation base stations\, and optical communications. Mr. Klein joined Qorvo (formerly TriQuint Semiconductor) in 2011.\n\nPrior to joining Qorvo\, Mr. Klein spent 13 years with Raytheon Space and Airborne Systems. Most recently\, Mr. Klein was the general manager for Raytheon's Advanced Products Center. APC led the design and manufacturing of radio frequency (RF) subsystems and components for cutting-edge military equipment. Before assuming that role\, Mr. Klein served as vice president of Mission Systems Integration for Raytheon Space and Airborne Systems.\n\nMr. Klein earned his Bachelor of Science and Master of Science degrees in electrical engineering from Texas A&M University in College Station\, Texas. He is the author of numerous publications in the area of microwave circuits.\n\nAbout Qorvo:\n\nQorvo (NASDAQ:QRVO) is a leading provider of core technologies and RF solutions for mobile\, infrastructure and aerospace/defense applications. Qorvo was formed following the merger of RFMD and TriQuint\, and has more than 6\,000 global employees dedicated to delivering solutions for everything that connects the world. Qorvo has the industry's broadest portfolio of products and core technologies\; world-class ISO9001-\, ISO 14001- and ISO/TS 16949-certified manufacturing facilities\; and is a DoD-accredited 'Trusted Source' (Category 1A) for GaAs\, GaN and BAW products and services. For the industry's leading core RF solutions\, visit www.qorvo.com.\n\n\n\n\n\n\n\n Your registration data may be provided to sponsors of this event.
X-ALT-DESC;FMTTYPE=text/html:<h1><span style="font-size: 22px\;"><strong><span style="color: rgb(0\, 0\, 0)\; font-family: arial\;">How AI\, IoT and 5G are changing the semiconductor industry</span></strong></span></h1>\n<span style="color: rgb(0\, 0\, 0)\; font-family: arial\; font-size: 18px\;">Featuring&nbsp\;<strong>James Klein</strong></span><span style="color: rgb(0\, 0\, 0)\; font-family: arial\; font-size: 18px\;">\, President of Infrastructure and Defense Products\,&nbsp\;<strong>Qorvo</strong></span><br />\n<br />\n<strong style="color: rgb(0\, 0\, 0)\; font-family: arial\; font-size: 18px\;">presented by&nbsp\;<br />\n<a href="https://utdesign.utdallas.edu/"><img alt="" height="139" src="https://chambermaster.blob.core.windows.net/userfiles/UserFiles/chambers/9090/Image/utdsignstudio.png" style="width: 200px\; height: 139px\; margin: 5px\;" width="200" /></a></strong><br />\n<span style="font-family:arial\,sans-serif\;"><span style="font-size:12.0pt\;">AI\, the Internet of Things and 5G are rapidly changing the semiconductor industry in its quest to meet the world&#39\;s insatiable need for more electronics especially in the automotive and manufacturing sectors.&nbsp\; This presentation will explore the opportunities and the challenges facing the semiconductor industry as it develops the next generation of chips that will transform the industry and ultimately change our world.</span></span><br />\n<br />\n<span style="color: black\;"><span style="font-family: arial\, sans-serif\;"><span style="font-size: 12pt\;"><em>About the speaker:</em></span></span></span>\n\n<p dir="ltr" style="line-height: 1.68\; margin-top: 0pt\; margin-bottom: 0pt\;"><span id="docs-internal-guid-0ed70d25-7fff-d577-9c35-bf9a64bd2785"><span style="font-size: 12pt\; font-family: Arial\; color: rgb(0\, 0\, 0)\; background-color: transparent\; font-weight: 700\; font-variant-numeric: normal\; font-variant-east-asian: normal\; vertical-align: baseline\; white-space: pre-wrap\;"><img alt="" height="376" src="https://chambermaster.blob.core.windows.net/userfiles/UserFiles/chambers/9090/Image/jameskleinhighresphoto.jpg" style="width: 250px\; height: 376px\; border-width: 3px\; border-style: solid\; margin: 5px\; float: left\;" width="250" /></span></span></p>\n\n<p style="box-sizing: border-box\; margin: 0px 0px 10px\; color: rgb(85\, 85\, 85)\; font-family: Verdana\, Helvetica\, Arial\, sans-serif\;"><strong style="box-sizing: border-box\;">James L. Klein</strong>&nbsp\;is the President of Infrastructure and Defense Products at Qorvo in Richardson\, Texas. The Infrastructure and Defense Products division comprises a broad portfolio of industry leading products and foundry services supporting applications including radar\, next generation base stations\, and optical communications. Mr. Klein joined Qorvo (formerly TriQuint Semiconductor) in 2011.</p>\n\n<p style="box-sizing: border-box\; margin: 0px 0px 10px\; color: rgb(85\, 85\, 85)\; font-family: Verdana\, Helvetica\, Arial\, sans-serif\;">Prior to joining Qorvo\, Mr. Klein spent 13 years with Raytheon Space and Airborne Systems. Most recently\, Mr. Klein was the general manager for Raytheon&rsquo\;s Advanced Products Center. APC led the design and manufacturing of radio frequency (RF) subsystems and components for cutting-edge military equipment. Before assuming that role\, Mr. Klein served as vice president of Mission Systems Integration for Raytheon Space and Airborne Systems.</p>\n\n<p style="box-sizing: border-box\; margin: 0px 0px 10px\; color: rgb(85\, 85\, 85)\; font-family: Verdana\, Helvetica\, Arial\, sans-serif\;">Mr. Klein earned his Bachelor of Science and Master of Science degrees in electrical engineering from Texas A&amp\;M University in College Station\, Texas. He is the author of numerous publications in the area of microwave circuits.</p>\n\n<p style="box-sizing: border-box\; margin: 0px 0px 10px\; color: rgb(85\, 85\, 85)\; font-family: Verdana\, Helvetica\, Arial\, sans-serif\;"><em style="box-sizing: border-box\;">About Qorvo:</em></p>\n\n<p style="box-sizing: border-box\; margin: 0px 0px 10px\; color: rgb(85\, 85\, 85)\; font-family: Verdana\, Helvetica\, Arial\, sans-serif\;"><strong style="box-sizing: border-box\;">Qorvo</strong>&nbsp\;(NASDAQ:QRVO) is a leading provider of core technologies and RF solutions for mobile\, infrastructure and aerospace/defense applications. Qorvo was formed following the merger of RFMD and TriQuint\, and has more than 6\,000 global employees dedicated to delivering solutions for everything that connects the world. Qorvo has the industry&#39\;s broadest portfolio of products and core technologies\; world-class ISO9001-\, ISO 14001- and ISO/TS 16949-certified manufacturing facilities\; and is a DoD-accredited &#39\;Trusted Source&#39\; (Category 1A) for GaAs\, GaN and BAW products and services. For the industry&#39\;s leading core RF solutions\, visit&nbsp\;<a href="http://www.qorvo.com/" style="box-sizing: border-box\; background-color: transparent\; color: rgb(93\, 121\, 168)\;">www.qorvo.com</a>.<br />\n<br />\n<br />\n<br />\n<em><strong><span style="border: 1pt none windowtext\; padding: 0in\; background-image: initial\; background-position: initial\; background-size: initial\; background-repeat: initial\; background-attachment: initial\; background-origin: initial\; background-clip: initial\;"><span style="color: rgb(47\, 47\, 47)\;"><span style="font-family: arial\, sans-serif\;"><span style="font-size: 9pt\;">&nbsp\;<span style="font-size: 14px\;">Your registration data may be provided to sponsors of this event.</span></span></span></span></span></strong></em></p>\n
LOCATION:Virtual Event A link and instructions will be sent upon registration
UID:e.9090.4618
SEQUENCE:3
DTSTAMP:20260505T005134Z
URL:https://business.techtitans.org/events/details/tech-industry-luncheon-july-17-4618
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